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Microchip Technology
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12/26/2025
Development Center (hsinchu), TW
Principal Engineer - Packaging
Tokyo, JP
Senior Client Engagement Manager
Boulder, US
Manager - Hardware Engineering
Lowell, US
Technician II - Manufacturing
Lawrence, US
Specialist I-Document Control
Lawrence, US
Senior Technician - Equipment (Calibration)
Detroit Sales Office, US
FAE - Senior Field Applications Engineer
Trondheim, Norway
Design Engineer II
Trondheim, Norway
Intern Microchip Norway
Trondheim, Norway
Intern Microchip Norway
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