Proven experience in process optimization for wide range of wafer sawing applications and packages using combined process/dicer machine and blade design base on engineering know-how

Reduce time-to-market by actively pursuing learning of blade performance and aligning customer interest with Application team at real time Provides the dicing blade business line with competitive and customer information gathering Manages technology development and new applications in maintaining a premier technology position Strong process DOE (Design of Experiment) & reporting skill Problem-solving and analytical skills to interpret product performance and how to meet customers’ criteria as success Excellent communication and problem analysis/solving skills