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IBM’s Research Division is looking for an experienced Semiconductor Packaging Manager to lead the chiplet and advanced packaging initiatives for IBM Semiconductors in Albany, New York. Candidate should have strong leadership skills and background in leading large teams on technical projects both hands on and as a leader. The candidate should also possess deep knowledge in a wide areas of advanced packaging technology ranging from flip chip assembly, Thermo-compression bonding, hybrid bonding, 2D, 2.xD, 2.5D, 3D assembly, laminate, reliability, and failure analysis among others. The candidate will lead a team of multi-disciplinary, multi-cultural, research and development engineers who will be working in the crossroads of advanced logic technologies nodes with next generation semiconductor packaging technologies. The position also requires interaction with cross-functional and multi-company working teams that include engineers engaged in unit process development, materials and process development, structural/chemical/electrical analysis, and layout design