About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. 

Your Team, Your Impact

The Marvell - Central Engineering Packaging organization drives semiconductor IC package development from concept to mass production and is responsible for supporting customers with advanced custom package designs that meet challenging electrical requirements. Many of the new designs are requiring multi-chip and multiple component configurations driving advanced technology requirements. There is the excitement of always working on new projects and cutting-edge technologies.

Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond.

What You Can Expect

You will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. You will also interface with package layout design team, ensure manufacturability, and compliance with performance, reliability, and cost requirements. You will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.

What We're Looking For

Bachelor’s degree in Electrical Engineering with 3 - 5 years of related professional experience or Master’s/PhD in Electrical Engineering with 1-3 years of experience.Strong fundamentals in electromagnetics (EM), transmission lines and microwave theory, Signal and Power Integrity.Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity, CST Studio Suite, HyperLynx.Frequency domain and time domain knowledge of high speed signaling.Experience with channel simulations using MATLAB, ADS or other tools. Power plane design, modeling and analysis using tools like PowerSI, Ansys SIwave.Familiarity with IC package or PCB layout tools like Cadence APD, Mentor PADS, Xpedition Package Designer.Experience with 2.5D/3D package development is desirable.Working knowledge of circuit design tools (e.g. Spectre, ADS, HSpice, Ansys Electronics Desktop Circuit Design). Familiarity with packaging technologies, materials, package substrate design rules and assembly rules.Working experience or knowledge of memory protocols and interfaces, like GDDR5, GDDR6, HBM, LPDDR is a plus.Track record of new product introduction from concept, through development and production is a plus.Knowledge of the thermal and mechanical analysis of the IC package development is a plus.​Ability to automate the SI, PI and Packaging activities using scripting tools like Python, Skill or TCL is a plus.Must have strong teamwork skills, as well as strong communication, presentation, and documentation skills.Good English knowledge both verbal and written.

Additional Compensation and Benefit Elements

With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it’s like to work at Marvell, visit our Careers page.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

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