Please Note:

1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)

2. If you already have a Candidate Account, please Sign-In before you apply.

Broadcom is looking for a Principal level high speed analog mixed-signal desgn engineer.

Qualifications include:

MS in Electrical Engineering or Computer Engineering with 10+ years of experience in advanced node CMOS high speed analog and mixed signal development or PhD in Electrical Engineering or Computer Engineering with 7+ years of experience in advanced node CMOS high speed analog and mixed signal development.

Candidate must have recent design ownership in 5nm and 3nm technologies.  

Experience in designing low jitter, low power PLL, VCO and clocking circuitry in advanced CMOS nodes. 

Deep understanding of advanced clock distribution techniques such as resonant and traveling wave clocking. 

Proficiency in electromagnetic tools like EMX or similar.

Experience in assessing design bugs and recommending fixes or workarounds to balance technical requirements with schedule.

Experience in design management with detailed knowledge of development methodologies, design flows including EDA integration, foundry PDK and associated collaterals.

Deep understanding of signal integrity and power integrity for high-speed designs.

Good understanding of design tape-out to foundries and solid understanding of supply chain for ASIC product development.

System knowledge of current generation and next generation of silicon photonics-based transceiver architectures and standards is highly desirable. 

Strong analytical thinking and problem-solving skills with excellent attention to details.

Must be organized, self-motivated and able to work effectively across internal and end customers teams.

Must have excellent knowledge/experience with TSMC 7nm-5nm, i.e. understanding of power consumptions, area, estimated design and layout efforts for digital and analog blocks, technology limitations.

It is desirable if the candidate has a good understanding of advanced packaging (2.5D / 3D) architectures.

Highly Desired Qualifications:

Strong written and verbal communication skills, with the specific ability to speak to various technical and management levels. 

Proactive, collaborative and creative approach to innovation, technical development and consensus facilitation to influence optimal project results. 

Excellent time and task management, and interpersonal skills. 

Willingness to travel when required. 

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $141,000 - $225,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.