Defect Metrology Application Engineer:

This position is within the process diagnostics and control (PDC) group, which deals with advanced imaging together with cutting edge image processing algorithms in order to detect, measure and classify nanometer size defects from semiconductor fabrication process steps.

 Application engineers are supposed to maximize the performance of our new defect metrology products through a deep and thorough understanding of use-cases in close technical collaboration with leading-edge chip manufacturing customers.

At a higher expertise level, they also contribute to product development roadmap through spec definition and performance validation.

 Desired qualification:

1.            Sound fundamentals of high-NA DUV imaging/SEM and light-matter/electron-matter interaction

2.            Open to 70% travel to leading semiconductor chip manufacturing fabs overseas

3.            Lab/fab hands-on experience in semiconductor fabrication with layer-wise detailed knowledge of material, process tech and defectivity

4.            Detail oriented with strong analytical, problem solving and communication skills

5.            Ability to work in a team, and ability to work independently

Qualifications

Education:

Bachelor's Degree

Skills:

Certifications:

Languages:

Years of Experience:

1 - 2 Years

Work Experience:

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 75% of the Time

Relocation Eligible:

Yes

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.