Company:Qualcomm India Private Limited

Job Area:Engineering Group, Engineering Group > Software Engineering

General Summary:

Automotive Power/Thermal Software products team at Qualcomm to achieve industry leading Power/Thermal/Limit SW management solution on QualcommNext gen Automotive chipsets.In this position, the candidate will be working with cross-functional teams to identify Power optimizations/Perf tuning, thermal/limitsHW tuning/characterization/risks assessment and provide optimized solutions with proper Mitigation.The candidate will need to perform system level analysis of Power/thermal use cases, expected to collaborate with Architecture, HWdesign, Performance, Power/Thermal Systems and various software teams to work towards optimal system level Power/thermal SW solution.In addition, the candidate will need to develop tools and methodologies for competitive analysis to learn about competitors strengthsand weaknesses, and come up with thermal mitigations schemes that are best in the industry.Candidate must  have  fundamental understanding on Linux/Android  power management  framework.

Minimum Qualifications:

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.

1-2 years experience with Programming Language such as C, C++, Java, Python, etc.Preferred QualificationsSystems/HW background with a good understanding of microprocessor architecture and common SoC hardware blocks (Interconnects, Display Graphics etc.)Operating systems concepts - scheduling, memory management, process management, interrupt handling and device driversUsing debug tools like JTAG debugger, oscilloscopes, logic analyzers.Knowledge on power or Power/thermal management SW development.In-depth knowledge in the areas of Embedded Systems, Microcontrollers, SoC Power, Modem, Multimedia, and Wireless communications, System level debugging and analysis for SoC power optimizations.

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