We are seeking an engineer for the Defect Inspection and Yield Characterization team to drive defect inspection strategy and yield improvement for Chiplet and Advanced Packaging programs. The engineer will be responsible for creating defect inspections and providing data analysis to find key yield issues, identify root cause, and drive issues to resolution. This role will involve evaluating and implementing new inspection tools and capabilities. The engineer will work with equipment vendors, as well as IBM integration and process teams, to identify areas for collaboration and inspection optimization.