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Job Description:

Job Summary:

The Failure Analysis (FA) Engineer performs detailed electrical and physical failure analysis for all MCHP products using non-destructive analytical tools, curve tracing, electrical ATE and bench characterization, defect/fault localization, sample preparation, destructive physical FA techniques, and material analysis. Responsible for providing FA reports, regular FA updates, and timeline to customers. Works with different cross-functional team such as FA counterparts, CQE, Quality, Reliability, Apps, Design, Foundry, Test and Product Engineering, and Wafer fab as appropriate to resolve FA cases.

Specific Duties & Responsibilities:

Performs detailed electrical and physical failure analysis for all MCHP products using non-destructive analytical tools (such as X-ray, Scanning Acoustic Microscope (SAM), and Optical microscopes), electrical bench verification tools and ATE datalog interpretations, circuit schematics interpretation, fault isolation techniques (such as Photo Emission Microscope (PEM), Thermal Emission/Hotspot Analysis, Optical Beam-Induced Resistance Change (OBIRCH), and die level microprobing), deliding/delayering techniques (such as chemical and laser decapsulation, chemical etch, dry etch, mechanical polishing, or combination of different etches), and SEM/EDX analysis.Works with fellow engineers both local and other Failure Analysis engineering counterparts from different Microchip sites to develop failure analysis techniques and capabilities if needed.Works with different cross-functional team such as FA counterparts, CQE, Quality, Reliability, Apps, Design, Foundry, Test and Product Engineering, Line Engineering and technicians, and Wafer fab as appropriate to resolve FA cases. Works with external or 3rd party FA laboratory to utilize advanced FA technique capabilities needed for analysis.Reviews assigned failure analysis case and request additional information if needed.Ensures that historical data are reviewed for any relevant information that can be used for the analysis.Performs and/or reviews initial analysis and define appropriate next analysis steps.Provides regular FA updates and timeline to customer.Ensures that FA reports are release on time based on target average cycle time.FA focal person responsible in advanced tools/equipment 5S and improvements and coordination with FAREL Equipment group for consumables & spare parts procurements, repair, and maintenance.Generates comprehensive failure Analysis Report based on analysis findings.Supports and implements Environmental Management Systems and Quality Management Systems standardsObserve safety and housekeeping “Clean as you go” during day-to-day failure analysis activities.Develop and implement new failure analysis methods if necessary.Expert on at least one field - either in a product device family, die, and package technologies.Help train/mentor FA Inspectors, Technicians, and Junior engineers if needed.

Requirements/Qualifications:

Education Level

Preferably Graduate of Bachelor or Master in Electronics Engineering, Electrical Engineering, Physics with w/ a semiconductor bias.

Work Experience

Has minimum of 4 years relevant experience in a semiconductor or electronics manufacturing environment with work experience from Quality and Reliability, Failure Analysis, Product or Process Engineering.

Other Requirements

Good knowledge and experience in electronic /electrical circuit and material analysis.Able extract, analyze, and report data as necessary.Computer literate (MS Word, PowerPoint, and Excel).Able to communicate and coordinate throughout all levels and functions of the organization as a team player with little supervision.Good knowledge of tools and methods related to inspection and analysis of components of both package and die form in semiconductor industry environment.Good interpersonal and communication skills (verbal and written) with the capability to interface throughout all levels and functions.

Travel Time:

0% - 25%