Major Duties and Responsibilities: + Responsible for introducing new products from characterization, validation, large scale, qualification, and safe launch for mass production releases in dicing, die attach, clip attach, reflow and defluxing processes. + Performs package design review, and risk analysis and conducts material evaluations suitable for the package & process + Review engineering builds requirements and engineering instructions for new products + Responsible for reviewing, generating, updating, and approving specifications + Achieves operational objectives by contributing information and recommendations on new product releases + Preparing and completing assembly build qualification reports, production release documents per device and systems configurations **onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. **More details about our company benefits can be found here:** https://www.onsemi.com/careers/career-benefits We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.