We are seeking experienced engineers in the area of plasma etch for semiconductors and related devices, including cutting edge logic, emerging memories, and advanced packaging. Some of the job responsibilities include the development and optimization of plasma etch processes, creation and analysis of advanced patterning sequences, and definition of the path for leading patterning methodologies from concept through implementation.  The candidates must have strong understanding of the fundamental principles of plasma etch and a track record of sharing that knowledge with colleagues in the work environment. The positions require interaction with cross-functional and multi-company working teams that include engineers engaged in unit process development, process integration, design/layout, materials and process development, and computational technology. Generation of Intellectual Property for IBM and protection of it through the patenting process are also expected. The hired candidates must possess strong analytical and design-of-experiment knowledge, and excellent written and verbal communication skills in English.

Candidates must be willing to work on site in Albany, NY, with occasional day travel to Yorktown Heights, NY, and infrequent overnight travel to various locations worldwide.