Job Profile Summary

The Firmware Design Engineer is responsible for full lifecycle development of custom thermal control application firmware.

 

Job Description

 

Boyd’s Thermal Test and Control Systems division, located in Phoenix, Arizona, is developing innovative thermal test solutions for the semiconductor industry. The engineering team is seeking to grow our multi-disciplined engineering team to tackle new challenges in the industry and is seeking a talented Firmware Design Engineer to fill a critical role within the team. If you are a motivated and self-starting engineer interested in understanding entire systems and applying your understanding to turn concepts into great products, we are looking forward to you joining our team.

 

General Responsibilities

The Firmware Design Engineer will be a member of a multi-discipled engineering team to provide innovative thermal test solutions to the semiconductor industry.

 

The role will include:

Working with multi-discipline team to develop thermal control products involving a diverse set of custom thermal forcing hardware Full lifecycle development of custom thermal control application firmware Supporting proof-of-concept studies Using tuning parameters to effect dynamic performance of feedback control systems Maintenance and enhancement of firmware on existing thermal products Firmware development using Qt/C++ for application development for Linux OS target and using C for non-OS/bare-metal target.