About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. 

Your Team, Your Impact

Marvell’s Central Engineering team is seeking a talented High-Speed IC Package Layout Design Engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting data rates up to 224 Gb/s. The engineer will be responsible for package layout, including all signal and power integrity routing, while considering manufacturing and assembly tolerances. Additionally, the engineer will interface with package suppliers to aid in the selection of IC package technology, ensuring manufacturability and compliance with design rules for assembly.

What You Can Expect

Design and develop 2.5D packages, such as CoWOS.

Utilize IC package layout tools like Cadence APD or Mentor XPD.

Implement IC package design requirements for high-speed interfaces and manage setup constraints.

Interface with IC physical design teams to optimize the ASIC die floor plan.

Collaborate with substrate suppliers, OSATs, and silicon fab vendors.

Work with IC package assembly development teams to understand and meet assembly requirements.

Automate layout tasks using scripting.

Design power planes and translate power supply requirements into the design.

Stay updated with IC packaging technologies, materials, substrate design rules, and assembly rules.

Contribute to new product introductions from concept through development and production.

Apply knowledge of thermal and mechanical analysis in IC package development.

Communicate effectively and document processes clearly.

What We're Looking For

Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience.

OR Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience.

Experience with 2.5D package design and development, such as CoWOS.

Strong expertise in using IC package layout tools like Cadence APD or Mentor XPD.

Understanding of IC package design requirements for high-speed interfaces and setup constraints manager.

Experience in interfacing with substrate suppliers, OSATs, and silicon fab vendors.

Experience with IC layout tools is highly desired.

Ability to automate layout tasks using scripting.

Familiarity with IC packaging technologies, materials, substrate design rules, and assembly rules.

Track record of new product introduction from concept through development and production is a plus.

Knowledge of thermal and mechanical analysis of IC package development is a plus.

Strong communication, presentation, and documentation skills.

Additional Compensation and Benefit Elements

With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it’s like to work at Marvell, visit our Careers page.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

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