**Change the world. Love your job.** As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the Packaging organization. **Responsibilities may include:** + Define product and package strategies to address high voltage market needs in automotive (600-1800V), industrial (600-3300V) and consumer (<100V) markets + Ability to translate system level needs into product and packaging problem statements and drive to deliver solutions + Define solutions across various HV technologies like Superjunction MOSFET, IGBT, and Wide Bandgap + Understanding of system and package level thermal challenges and solutions + Collaboratively work across teams including business units, process technology and packaging technologies to come up with comprehensive High Voltage product / technology roadmaps with clear execution plans to enable these roadmaps + Program Management type tasks to work in worldwide TI cross functional teams to collaboratively define, develop and successfully introduce products to the market in a timely fashion **Why TI?** + Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. + We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI (https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012) + Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. **About Texas Instruments** Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com . Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws. If you are interested in this position, please apply to this requisition. **Minimum requirements:** + Master's degree in Electrical Engineering, Mechanical Engineering or related engineering degree + 5+ years of experience in High Voltage (200V-1200V) semiconductor technologies across IGBT, Superjunction MOSFET’s, and/or SiC technologies **Preferred qualifications:** + Experience with High Voltage Discrete packaging and power module design (Molded and Case) + Experience with material or assembly flow development for High Voltage integrated circuits + History of introducing product and package technologies and products from product definition to high volume production + Strong knowledge of silicon/GaN/SiC-package interaction + Strong knowledge of High Voltage discrete and Power Modules reliability and qualification requirements, failure modes and mission critical profiles for end equipment’s + Ability to communicate with customers and understand their needs and roadmaps + Strong knowledge of High Voltage Bill of Materials (Mold compounds, Die Attach, DBC substrates etc) suppliers and their roadmaps + Strong knowledge of industry and subcon High Voltage packaging technologies (Molded and Case) and their roadmaps + Strong knowledge of silicon/GaN/SiC-package interaction and hands on experience with stress, thermal and electrical modeling analysis and tools + Experience/knowledge of bumping, wafer level processes is a plus