Company:Qualcomm Communication Technologies Ltd.

Job Area:Engineering Group, Engineering Group > Hardware Applications Engineering

General Summary:

The candidate will work within customer engineering team and need to provide electrical design expertise/simulation directly to customers in the areas of signal integrity and power integrity for the design of compute/wireless products and development systems.

Responsibilities

Perform various PCBA board level PDN and SI simulation analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory, USB4, PCIe, MIPI CSI, eDP interfaces and variety of serial interfaces.Perform laptop motherboard compliance end to end simulation （ ie: eye pattern) from SoC to Camera module ,USB connector via FPC/ retimer, eDP panel by using IBIS model.Analyze and provide design guidance on PCB power distribution networks using established methodologies.Document, distribute, and present results at appropriate meetings.

Qualifications

2 to 4 years of experience in the following areas:

Electromagnetic theory and transmission linesBasic signal and power integrity conceptsCommercial 3D electromagnetic field solverCommercial SI or RF analysis toolsSPICE transient simulation including use of IBIS models

The following experience is a plus:

DDR and LPDDR design and analysisHigh speed serial IO design and analysisAnsys, Cadence/Sigrity, Keysight, SI/PI tools, and MATLAB desirableSpreadsheets and similar productivity toolsMentor or Cadence board design toolsCandidates having sound knowledge in Signal processing techniques, Electromagnetic theory, Transmission lines design concepts will be highly preferred.

Education Requirements

Minimum Bachelor degree in Electrical Engineering or related discipline, Master degree preferredYou will be responsible for end-to-end interconnect design signoff and design guidelines for external customers.

Minimum Qualifications:

• Bachelor's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 2+ years of Hardware Applications Engineering or Hardware Design experience or related work experience.
OR
Master's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 1+ year of Hardware Applications Engineering or Hardware Design experience or related work experience.
OR
PhD in Electrical/Electronics Engineering, Computer Engineering, or related field.

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