ASML/Brion brings together the most creative minds in science and technology to develop computational lithography software to enable customers on the best process window enhancement solution for the next generation HighNA EUV scanner, as well as best process window control solution to mitigate the process variation during the scanner operation, providing holistic solution for advanced nodes in semi-conductor industries.
Role and responsibilitiesFeasibility study of advanced imaging for ASML scanner application, including study the imaging impact with illumination, mask correction, aberration, overlay and mirror/lens heating. Design software component to support customer’s request on process window enhancement and process window control for ASML scanner application Perform qualification test, lead wafer validation and generate proof data, provide training slides, user guide and other technical documents. Work with local application engineer to support customer activity, promoting ASML scanner and application adoption.Education and experiencePursuing PhD., or Master’s degree in Optics, EE/ME, Physic with experience in optical design, lithography, semiconductor/EDA industry Solid understanding of Fourier Optics Imaging and Abbe/Hopkin Imaging Theory Knowledge/hands-on experience with Simulation software/technical tools (i.e. Python, Matlab, etc.) Experience with rigorous optical simulation is a plus (FDTD, RCWA) Soft skill requirements (i.e. strong English communication skills – both written and oral, ability to influence, etc.). knowledge of data analytics and machine learning. Knowledge in optimization theory, including Convex optimization theory and gradient based optimization . SkillsKnowledge/hands-on experience with simulation software/technical tools (i.e. python, matlab, etc.)
Soft skill requirements (i.e. strong English communication skills – both written and oral, ability to influence, etc.).
knowledge of data analytics and machine learning.
Solid understanding of imaging theories (Abbe, Hopkins).
Direct or indirect experience in OPC (Optical Proximity Correction), including rigorous lithography simulation (Hyperlith, Prolith), RET, and advanced mask technology.
Experience in lithography or related fields.
Knowledge in EUV lithography and challenges.
Knowledge in optimization methods
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