The team you will be a part of

Our Radio Development R&D Team is looking for motivated junior hardware engineers to be part of a team involved in the development, testing, and design maintenance of 5G/6G cellular base stations.

You will join the RAN Business Unit and will enjoy our culture of innovation, openness, discipline, simplicity, accountability, and profit mindset. Your future teams are developing Nokia 3GPP mainstream radio technology products and solutions including cross-technology responsibility (Multi Radio Access Technology). Your unit’s main priorities are flawless execution of System programs including Network Management & Optimization and attached services. 

Required skills:

High school diploma or GED and 2 years of relevant experience. Associate’s Degree or Technical Certification in a related field preferred. 

Superior soldering skills with knowledge of how to solder/rework the many different components in the radio.  Understand and able to read schematics and PCB overlays  Knowledgeable of different electrical test equipment and management of the lab equipment, including tracking for the whole lab. Knowledgeable of the different electrical components and the different package types  Ability to work independently at a fast pace with attention to high-quality output.  Perform work safely and in accordance with company standards and safety regulations.  Proficiency in office software including Microsoft Visio for reading diagrams  Ability to read, write, and interpret information with good verbal communication skills in English  Positive attitude and ability to work in a close diverse team environment  Ability to lift and/or move over 50 lbs

 

What you will learn and contribute to

MN RF R&D responsible for 5G BTS development is looking for a technician to participate in the development of cellular base stations. 

In this job, you will: 

Support engineers with radio builds, reworks, and repairs through the development cycle.  Assemble and disassemble radios with attention to following the same defined procedures used by factories.  PCB soldering (new and repair) of individual components including high pin count BGA, very small chip components, large PA devices, shields, and cables Repair of PCB and cable assemblies with a minimal level of electronic troubleshooting  Tracking of reworks and the radios, boards, and components.  Managing distribution of radios/boards through the lab and with Receiving/Shipping including all necessary paperwork and packaging.  Tracking/ordering the lab equipment for calibration, capability, and availability.