Experience Required: 6+ years
Education: Btech/Mtech Electronics/Electrical engineering
 
Skills/Experience:
- Experience in Analog Mixed-signal DDR/HBM IP layout and verification of high-speed digital layout and solid understanding of high speed signal
- Advanced understanding of Deep submicron effects and mitigation, Advanced tool usage, Advanced floorplanning techniques, understand digital flow, Advanced strategies.
- Solid understanding of CMOS and FinFET layouts and process technology in 28nm and smaller.
- Good understanding of ESD and latchup layout design considerations.
- Familiarity with ASIC physical design flow: LEF generation, Place & Route & understanding of top level verification flow, DRC/LVS, LPE.
- Good understanding of IO frame and pitch requirements, power rail routings, IO abutment rules and requirements, bondpad layout, EM and IR considerations, DFM, etc.
- Scripting skills for layout automation is a plus
- Remote site interaction, layout co-ordination activities, ability to foster accountability and ownership through hands-on technical leadership.
- Excellent written and verbal communication skills in interactions with customers, and internal development teams.
 
Responsibilities:
- High Speed DDR/HBM Layout design
- Provide subject matter expertise & technical leadership in High Speed design such as DDR/HBM.
- Work with DDR PHY team, package engineers and system engineers to meet design specs.
- Perform scheduling duties, Remote site interaction etc.
- Work with local team to support critical layout and floorplanning requirements
- Coordination duties with other layout teams both in Bangalore and globally, to detail out layout activities and obtain layout deliverables. This includes reviewing and quality checking from remote Layout teams.
- Strict flow adherence and policing of internal policies to secure schedules.