Lead Digital Circuit Designer
General Electric Company
Job Description SummaryAs an Lead Digital Design Engineer, you will be at the forefront of designing cutting-edge embedded systems for aerospace applications, adhering to DO-254 standards for New Product Introductions (NPIs) and Product Refreshes. Your expertise will shape avionics hardware architectures and support new bids and proposals.
In this dynamic role, you will collaborate with lead design engineers on board-level circuit design, integration, verification, and documentation of state-of-the-art aerospace processors and FPGA assemblies. This position combines some leadership with hands-on technical work, requiring you to contribute at every stage of the design cycle.
You will operate within defined parameters to make critical decisions, apply innovative concepts to complex challenges, and drive solutions through immediate action or short-term planning. Join us to influence the future of aerospace technology and take your career to new heights!Job Description
To comply with US immigration and other legal requirements, it is necessary to specify the minimum number of years’ experience required for any role based within the USA. For roles outside of the USA, to ensure compliance with applicable legislation, the JDs should focus on the substantive level of experience required for the role and a minimum number of years should NOT be used.Additional Information
In this dynamic role, you will collaborate with lead design engineers on board-level circuit design, integration, verification, and documentation of state-of-the-art aerospace processors and FPGA assemblies. This position combines some leadership with hands-on technical work, requiring you to contribute at every stage of the design cycle.
You will operate within defined parameters to make critical decisions, apply innovative concepts to complex challenges, and drive solutions through immediate action or short-term planning. Join us to influence the future of aerospace technology and take your career to new heights!Job Description
Roles and Responsibilities
Design complex avionics systems, integrating both digital and analog components.Stay aware of technology trends and advancements in embedded systems and electronic components.Design processor and FPGA assemblies, including schematic capture, component placement, layout constraints, PWB stack-up, and layout review/approval.Conduct board bring-up, integration, and verification activities to ensure robust performance.Troubleshoot mid-high complex issues involving processors, FPGAs, and memory components.Apply Design for Manufacturing (DFM), Maintainability, and Testability principles to enhance product quality.Participate in architectural trade studies and proposal development to drive strategic decisions.Interface with customers independently, providing expert guidance and support.Mentor junior engineers, fostering their growth and development.Lead and coordinate multi-disciplinary design teams, ensuring cohesive and effective collaboration.Propose and implement improvements in internal processes to drive efficiency and innovation.Required Qualifications
Bachelor’s degree in Electrical Engineering or related field.Proven experience in board-level digital design, including schematic design, implementation, integration, and verification.Expertise in designing high-speed interfaces.Proficient going through application notes for complex components.Understanding in Board Level Timing Analysis, Stress and Derate Analysis, Signal Integrity & Power Integrity.Strong problem-solving skills with the ability to break down complex issues and apply critical thinking.Great technical writing and communication skills.Experience mentoring and sharing expertise with junior engineers.Desired Characteristics
Master’s degree in Electrical Engineering with 6+ years of professional experience in digital design.Proven track record of designing complex digital hardware systems.In-depth knowledge of the board-level digital design process, from schematic capture to implementation, integration, and verification.Expertise in laying out complex Printed Wiring Boards (PWBs).Experience designing with high-speed components such as Gigahertz microprocessors, FPGA, CPLD, DDR3 or DDR4 memory, flash memory, Gigabit Ethernet, and PCIe.Proficiency in working with large pin count devices, featuring 1000+ pins with 0.8mm device pitch or smaller.Skilled in High Density Interconnect (HDI) technologies, including micro vias, buried/blind vias, and back drilling for IPC Class 3 boards.Experience in designing high-speed serial links of 5+ Gbps, such as 10GBASE-KR, PCIe Gen3, and Fiber Optics.Familiarity with communication protocols like CAN, MIL-STD-1553, ARINC 429, ARINC 664, and TSN.Knowledge of OpenVPX and PICMG standards.Extensive experience in the Military, Aerospace, or Avionics sectors.Proficient with Mentor Graphics Expedition Enterprise and HyperLynx PI/SI tools.Familiarity with OrCAD PSPICE or LT Spice, Mathcad, Microsoft Office, and Microsoft Visio.Strong technical writing and communication skills.Ability to break down complex problems and apply critical thinking to develop effective solutions.Note:
To comply with US immigration and other legal requirements, it is necessary to specify the minimum number of years’ experience required for any role based within the USA. For roles outside of the USA, to ensure compliance with applicable legislation, the JDs should focus on the substantive level of experience required for the role and a minimum number of years should NOT be used.Additional Information
Relocation Assistance Provided: No
Confirm your E-mail: Send Email
All Jobs from General Electric Company