About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com . Summary of Role : We are seeking an experienced Package (SiPh) Applications Engineer. You will be responsible for the preparation of the quotes in response to customer requests in various packaging formats. The selected individual will assemble and lead team to address all package features adherence to customers product specification, timeline and achieve all major milestone target. This may include: Interaction with business to ensure non-standard items are recognized as such and paid for with added ASP by the customer. Essential Responsibilities : + Prepare quotes in response to the Business Unit (BU) customer requests in various package formats + Discuss package technology with customers and GF customer interface team and work to define complete package solution to meet customer requirements + Obtain vendor/OSAT partners quotes for product packages: unit cost, NRE, timeline, and special circumstances such as cooperative development + Highlight technology challenges and mitigation plans/costs/NRE + Work with vendor to optimize our product based on some or all of the parameters key to the product - minimum cost, minimum risk, rapid delivery + Manage development path to utilize existing GLOBALFOUNDRIES and OSAT partners roadmap + Lead the NPI engineering activities from feasibility study, prototype build, DOE planning and execution until product full qualification to start production. + Working with various cross functional organization such as internal teams (Fab-Process Integration, Product Engineering, Design, Test, QA,..etc ) and OSAT partners to bring product from package development to volume production and ensuring proper production hand over. + Support operation team in problem of highly technical and complex manufacturing issue. When faced with development issues, lead project members in investigating the root-causes and implementing appropriate countermeasure. + Continuously improve package technology follow the roadmap to achieve time, quality, and cost target. Required Qualifications : + Education: Bachelor’s degree in mechanical engineering/Materials Science/Physics or related field, plus 7 years semiconductor packaging experience (especially on SiPh), master’s plus 5 years semiconductor packaging experience, or Ph.D. plus 3-year experience. + Language Fluency – English (Written & Verbal) + Microsoft Office proficiency + Meticulous attention to detail + Flexibility / ability to learn new systems / software / tasks + Highly motivated individual with initiative and ability to routinely work independently Preferred Qualifications: + Three years of program management experience + Experience working with OSATs + Strong interpersonal skills and ability to work effectively in diverse, cross-functional teams + Strong written and verbal communication skill GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard. As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities. All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations. Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia