About SiTime

SiTime Corporation is the precision timing company. Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power and better reliability. With more than 3 billion devices shipped, SiTime is changing the timing industry. For more information, visit www.sitime.com.

SiTime Corporation (NASDAQ: SITM) is seeking a talented engineer to be a key player enabling SiTime’s MEMS-based timing products. SiTime, a MEMS and analog semiconductor company, offers

the industry’s best performing and most reliable timing solutions. Our team is passionate about solving the most difficult timing problems in high-performance electronics. The Package Design Engineer is responsible for the R&D, design, and qualification of unique custom packaging technology for SiTime’s revolutionary MEMS-based timing products. Responsibilities include new package technology development, packaging materials research and characterization, process development and optimization, simulation and design (including thermal, electrical, electromagnetic, mechanical, stress), package qualification and release-to-production. In addition, he/she will be responsible for managing local and overseas vendors in new package development activities including DoEs (Design-of-Experiments). The Package Design Engineer will have a highly visible role within the company, working cross-functionally to ensure system-level performance of SiTime’s ultra-stable timing products.

Responsibilities:

• Manage project development activities at OSATs

• Develop new packaging technology for SiTime’s MEMS-based timing solutions

• Optimize recipes and processes to improve long-term device performance

• Develop and manage DoEs running locally and overseas

• Perform thermal/electrical/electromagnetic/mechanical/stress simulation and design

• Lead new package qualification and release-to-production activities

• Lead troubleshooting activities related to package design or performance

Required Attributes:

• MS or PhD in Mechanical Engineering, Material Science, or equivalent science field

• Understanding of semiconductor packaging materials, such as epoxies, polymers, and solders

• Hands-on experience with mechanical and thermal simulation and design

• Hands-on experience with CAD software (AutoCAD preferred but not required)

• Hands-on experience with finite element analysis (COMSOL preferred but not required)

• Ability to manage in-house resources and overseas OSATs

Desired Attributes:

• Some knowledge of semiconductor IC packaging technology and methodology

• Hands-on experience with IC package modelling software and techniques

• MATLAB scripting ability

• Hands-on familiarity with lab instruments such as oscilloscopes, frequency counters, etc.

• Experience in developing and managing Design of Experiments (DoE)

• Experience with material characterization techniques (DMA, TMA, TGA, etc.)

• The desire to work in a fast-paced, challenging, and risk-taking environment

Benefits offered : 401k plan, health and wellness that includes medical, dental, vision, life, parental leave, legal services, and time off plans.

Base pay is one part of SiTime’s Total Rewards Package that is provided to compensate and recognize employees for their work. This role may be eligible for additional discretionary bonuses/incentives, and equity-based compensation.

SiTime is an Equal Opportunity Employer. We treat each person fairly and we do not tolerate discrimination or harassment against anyone on the basis of any protected characteristics, including race, color, religion, national or ethnic origin, sex, sexual orientation, gender identity or expression, age, disability, pregnancy, political affiliation, protected veteran status, protected genetic information, or marital status or other characteristics protected by law. SiTime participates in the E-Verify program.