1. Discrete Power Package Design (Lead Frame, Package Outline, Bond Diagram, Internal components) 2. Power Package design considering design rule and advanced design rule 3. Technical leading design related job locally and externally out of China 4. Designer who is expert level on 2D & 3D modeling, Knowledgeable on Geometric Dimensioning and Tolerancing, knowledge on Semiconductor Assembly Processes and Design Rules (Sawing, DA/SMT, Al/Au WB, Molding, Plating, TnF, FT, Packing), knowledge on Wafer Fab processing and understanding of Die mask & vertical structures of MOSFET/IGBT/DIODES/ IC's, Knowledge on Wire Bonding diagram generation., Perform Assembly Design Rule Check for all New Products Dev't., * Knowledgeable on Jedec & EIAJ Packaging Standard, Knowledge on Magazine, Plastic Tubes, and other Jig & Fixture **onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. **More details about our company benefits can be found here:** https://www.onsemi.com/careers/career-benefits We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.