Packaging Engineer
Texas Instruments
**Change the world. Love your job.**
As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
**Responsibilities may include:**
+ Develop new package requirements and maintaining quality of existing packages for all product groups
+ Define package requirements for product groups and customer requirements
+ Develop new package and process qualification programs.
+ Perform integrity analysis of packages utilizing appropriate tools
+ Perform package characterizations including cost effectiveness studies.
+ Act as a liaison with vendors
+ Maintain product quality while developing and introducing package cost reduction programs
+ Coordinate the introduction of new package processes into production
+ Prepare and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies
**Why TI?**
+ Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
+ We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI (https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012)
+ Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
**About Texas Instruments**
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com .
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.
**Minimum requirements:**
+ Bachelor's degree in Mechanical Engineering, Physics, Material Science, or a related field of study
+ Minimum 5 years' of relevant experience
**Preferred qualifications:**
+ Ability to engage with a geographically diverse team with a strategic vision to drive a complex technology roadmap
+ Ability to establish strong and collaborative relationships with stakeholders, global design & manufacturing teams and component/material/substrate supplier to meet on-time execution
+ Broad and deep technical understanding of QFN package integrated with wire bond interconnect, flip chip interconnect, passive component and inductor integration
+ Detailed understanding with experience of manufacturing process and demonstrated capability of taking new technology concepts to high yield, low cost and high-volume production
+ Familiarize on module package reliability requirement and module package defect criteria.
+ Knowledge in FMEA methodology, process control plan, statistical analysis, SPC and DOE methodology. Skilled in JMP statistical analysis software is an added advantage
+ Good at Microsoft software – power point, excel and outlook. Experience in packaging development, with expertise in QFN power module package and passive component integration
+ Experience with assembly of power modules packaging, substrate design and reliability requirements
+ Hands-on experience with flip chip, chip shooter or any other component attached equipment. Components are referring to resistors, capacitors, inductors, clips
+ Project management experience in semiconductor industry specifically in Assembly Test or SMT Operation
+ Key personal characters – trustworthy, inclusive, innovative, competitive, result-oriented
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