We are looking for an experienced and talented Packaging Expert to join our integrated photonics team. As a Package Designer (m/w/d), you will play a key role in the design and development of advanced photonic packaging solutions that enable the high performance and reliability of our photonic integrated circuits (PICs). You will work with multi-disciplinary teams to create innovative packaging designs that meet the technical requirements of advanced photonic systems. This is an exciting opportunity to be part of a fast-growing technology area, where you will contribute to the commercialisation and scaling of next-generation photonic technologies. 

Your role:

Package Design & Development:

Design and develop photonic packaging solutions for photonic integrated circuits (PICs), including mechanical, thermal, and optical interfaces.

Optimize package designs for performance, reliability, and manufacturability, considering thermal management, optical coupling, electrical connectivity, and mechanical stability.

Work with materials such as silicon photonics, III-V semiconductors, and fiber-optic components in packaging designs.

​

Prototyping & Fabrication:

Collaborate with external suppliers and internal teams to build prototypes and transition from concept to full-scale production.

Ensure design-for-manufacturability (DFM) principles are applied to the photonic packages to ensure scalability and cost-effectiveness.

Thermal & Mechanical Analysis:

Perform thermal and stress analysis of photonic packages to ensure proper heat dissipation and mechanical stability under varying environmental conditions.

Use simulation tools to validate the design and ensure performance under thermal cycling, vibration, and mechanical stress.

​

Optical Alignment & Integration:

Design package structures that optimize optical alignment between the PICs, optical fibers, optical components and external devices such as lasers and detectors.

Develop high-precision alignment and assembly techniques to minimize optical losses and enhance signal integrity.

Collaboration:

Work within a dedicated team of scientists and development engineers to drive the development of photonic technologies with respect to a wide range of applications.

Work closely with photonic designers, engineers, process engineers, and manufacturing teams to refine packaging solutions.

Support cross-functional teams in product development, providing input on package constraints and opportunities.

Testing and Validation:

Define test protocols to validate the performance and reliability of the packaging solutions.

Analyze data from thermal, mechanical, and optical tests to improve packaging designs and ensure product reliability.

Your Profile

Master’s degree or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.

Specialized knowledge or coursework in photonics, optoelectronics packaging, or microsystems.

3+ years of industry or academic experience in the design and development of packaging solutions, preferably for photonics, optoelectronics, or semiconductor devices.

Experience with packaging techniques such as wire bonding, flip-chip bonding, and fiber-optic alignment is highly desirable.

Experience working with optical beam assemblies is a plus.

Experience working with high-frequency electrical packaging and RF interconnects is a plus.

Proficiency with CAD tools for 3D modeling and simulation (e.g., SolidWorks, AutoCAD, or ANSYS).

Experience with thermal and stress simulation tools such as COMSOL or FEA software.

Understanding of materials used in photonics packaging, including ceramics, polymers, metals, and adhesives.

Familiarity with cleanroom and assembly techniques for photonic and electronic components.

Strong analytical and problem-solving skills, with attention to detail in complex systems.

Excellent communication and collaboration abilities, with a proactive approach to teamwork in English and German

Ability to work in a fast-paced, deadline-driven environment.

Your ZEISS Recruiting Team: