Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Identify, select, and evaluate new equipment/ new technology to support current and future requirements  

Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap  Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements  Work with equipment suppliers to develop new capability  Engage in active participation in Package Development Engineering activities  Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need  Create decision matrix for equipment and material selection  

Evaluate and qualify new equipment platform and handover to production group  

Plan/submit capital request to acquire new Equipment  Create and owner of purchasing specification (Doc2) document  Establish the new equipment qualification criteria and activities roadmap with respective functional teams Establish project handover requirements and procedures upon machine qualification  Prepare documentation for handing over with respective site owner  Conduct data gathering for low volume production  Conduct training for Site representatives  Feedback loop for Continuous Improvement after mass volume production via collaborate with production and HVM team on existing production equipment enhancement through continuous improvement projects 

Maintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platform  

Driving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyze the requirements to advance tool maturity level Maintain and regularly update the TOR, with inputs from local or other assembly site  Maintain general knowledge of process and material characteristics and translate to equipment design requirement  Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need  

Equipment System Readiness, Enablement & Enhancement 

Conduct equipment characterization, identify and enable the critical equipment parameter monitoring system Working with PCS, IT & Automation team to enable tool control system such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, IOT, ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicable Equipment automation solution enablement for both system datamation (tool- micron host communication) and factory AMHS readiness and deployment from equipment perspective follow by working with IT & automation team to delivery full automation solution for production running support 

Supplier Management & Engagement Program 

Working on several engagement forum from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefit Manage all the key and critical engagement activities between Micron and supplier to prioritize and enable quality and tool performance improvement  Collaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategies 

  

Job Requirements/ Qualifications:  

PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required   Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques Minimum 3 years’ experience in related semiconductor industry or related manufacturing environment Experience with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technology. Preferable experience on TCB , Die Attach, C2S, C2W, Hybrid Bonder Equipment and ProcessUnderstanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus   Fast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teams and external vendors  Strong communication (verbal & written) and presentation skills (English speaking is must) Understanding of business needs and customers’ requirement, able to participate in cross functional team environment Strong project management skills to ensure execution to timelines Seasonal Travel based on business need will be required

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.