Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR67213 PDE NPI Assembly Process Development Engineer (Evergreen)

As a PDE (NPI Assembly) Process (Development) Engineer, you will be primarily responsible for initiating, developing, and optimizing processes to enhance product quality and reliability. Your role will involve improving process yields, reducing costs, enhancing productivity, managing risks, and resolving manufacturing line issues. Additionally, you will be required to identify, diagnose, and address assembly process-related problems by applying failure analysis, FMEA, 8D, or FDC/SPC methodologies.

Responsibilities and Tasks General:

Align to Company and R&D policies, strategic objectives, goals and priorities.

Adhere to Company ethic and code of conduct Contribute to attain and maintain required certifications (Quality, Environment, Safety and Health)

Contribute to a Safe and Compliant Work Environment - Identify and promptly report hazards - Follow safety procedures and area work rules (including use of proper PPE, energy isolation, and chemical safety)

Follow and implement established policies. Contribute to achieve strategic objectives & goals based on priorities. Develop patent disclosure attitude. Develop and protect Micron’s intellectual property.

Individual competencies and technical expertise development.

Readily seek assistance when skills are in question.

Read relevant literature for deeper understanding and insight and apply it on research projects.

Continue learning through appropriate internal/external classes as applicable.

Continue learning "on the job".

Understand devices physics and behavior.

Communications and teamwork

Prepare and present data and reports to management and peers.

Favor teamwork through flexibility and positive attitude

Organize materials and data to be presented during meetings and actively participate to meetings.

Process Engineering General:

Coordinate and implement initiatives for the evaluation and optimization of process equipment and materials, ensuring effective changes at various process steps.

Lead / Participate in continuous yield improvement and cost reduction activities.

Qualify and Implement New Product, Process, Equipment and/or Material.

Validate and fan out new process baseline qualified.

Handle the NPI runs to meet the schedule of business cases/ new product introduction.

Assembly’s qualification procedures and reports

Define operation procedures Create the process recipes.

Create and implement the DoE.

Ensure materials compatibility with equipment and parameters.

Verify the machine capability to fulfill the requirements of new products Evaluate and Improve Assigned Assembly Manufacturing Processes, Materials, and/or Equipment.

Optimize process and ensure the process capability (CpK)

Determine root cause and implement corrective actions if any abnormality is found Evaluate/ Introduce New Process, Equipment, Material Technologies

Locate and research technical information on equipment, materials, and/or processes in journals, literature, web, etc

Identify supplier’s materials or equipment design and production processes.

Introduce new materials, equipment to fulfill the requirement of new products.

Create decision matrix for equipment and material selection.

Develop Process of Record (POR) and Tool of Record (TOR) Coordinate Training Requirements and Conduct Training

Develop, or coordinate development of, training materials for new processes/ machines.

Conduct training for production trainers train and mentor others.

Skillsets and Experiences preferred (Min. 5years experience required):

Wafer Bonding & De-Bonding

Experience with various dicing technologies such as Laser Grooving (L.G), Blade Dicing, Stealth Dicing, Laser Fluorescence Cutting (LFC), and Plasma Dicing.

Proficiency in Through-Silicon Via (TSV) interconnection processes and tools, including chip bonding, Mass Reflow (MR), and Thermocompression Bonding (TCB).

Expertise in metrology tools such as Automated Optical Inspection (AOI), X-ray inspection, and Scanning Acoustic Microscopy (SAM).

Experience with Tape and Reel process and tools at Wafer Level Chip Scale Package (WLCSP).

Research and development or process engineering experience in 2.5D/3D Packaging.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.