**Job Summary:** + Power module assembly process development (Plasma cleaning, Adhesion promoter coating, Pressfit pin insertion, Glue dispensing/Case attach, Si Gel filling, Terminal welding). + Technical Leadership on process technology development. + Technical Leadership on responsible processes between PIDC and Manufacturing. + Establish process POR through set up, feasibility and characterization followed by package development procedure. **onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. **More details about our company benefits can be found here:** https://www.onsemi.com/careers/career-benefits We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.