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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR68441 Principal, Wafer Bonding Process Integration Engineer

As a Principal, Wafer Bonding Process Integration Engineer within the Technology Development group at Micron, you will drive the development and integration of advanced wafer bonding technologies. Having an affinity with innovative solutions which can be applied throughout development to high-volume manufacturing, you will work with a multicultural, diversity and across functional team such as Process Integration Engineers, Device, Process and Operations in Japan and US as well.

Role

The Wafer Bonding Process Integration Engineer will be part of the future DRAM Technology Development and play a pivotal role in the industrialization of the new wafer bonding applications. The position is located in Hiroshima, Japan and provides expertise in Bonding processes. The job will involve the following functions.

Responsibilities include, but not limited to:

Lead the implementation of Wafer Bonding integration processes, ensuring the best performance and reliability.Work cross-functionally to define integration requirements and establish best practices for wafer bonding technologies according to product requirement.Drive innovation in wafer bonding methodologies, benchmark/evaluate new bonding technologies / solutions and stay updated on industry innovations and state-of-the-art techniques.Provide technical leadership and mentorship to junior engineersConduct deep dive analyses and troubleshooting of wafer bonding integration issues, leading and implementing corrective actions as necessary.Collaborate with Process teams in US to transition and setting up.

Requirements

Master’s Degree or equivalent experience in Electrical engineering, Semiconductor Device Technology, Physics, or related field.Minimum of 10 years of the industry experience, with 3-5 years in Wafer Bonding technology.Expertise in Fusion Bonding is required.Knowledge in the use of statistical process control and analysis tools.Strong understanding of material characterization and analysis techniques relevant to wafer bonding.Strong analytical and problem-solving skills, both technical and interpersonal.Pragmatic and flexible attitude with a result- and data-driven can-do mentality.Excellent communication skills, written and verbal communication in English.Japanese communication desired, but not mandatoryAbility to convey complex technical concepts to diverse audiences.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_jp@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.