Principal Hardware Engineer
Cisco
Meet the Team
You will be part of the outstanding GSM-Component Quality & Technology team. The team is a key hub of technical innovation at Cisco, with a broad scope of influence. Members interact with Business Units, Product Operations, Manufacturing Operations, Planning and Fulfillment, Supplier Management, and directly with Suppliers. Additionally, the team participates in industry consortia, conferences, and collaborates with academia and other strategic partners. The organization focuses on evaluating and adopting new technologies to help Cisco leapfrog the competition with sophisticated algorithms and solutions to solve complex problems.
Your Impact
In this role, you will:
* Develop and lead the system thermal technology roadmap in partnership with microelectronics packaging suppliers, thermal interface material suppliers, cooling solution providers, and internal partners to meet Cisco products’ needs.
* Investigate innovative thermal cooling solutions for hardware systems on a large scale.
* Derive trade-offs in thermal performance of different package design elements and chip thermal gradients from experimental test data.
* Develop test plans and qualification requirements to ensure mechanical and manufacturing adaptability of thermal cooling solutions.
* Engage with external vendors, including ODM and component vendors, on design, test, and production.
* Develop and publish case studies/technical papers describing thermal analysis of cooling systems.
* Establish parameters for thermal design/testing and correlate design/test results to model predictions.
* Contribute to analytical and numerical models using Computational Fluid Dynamics tools to simulate and analyze different device-level cooling schemes.
* Drive supplier ecosystem development and participate in industry consortia, conferences, and collaborate with academia and other strategic partners to influence Cisco’s industry position.
* Integrate Circuit Thermal simulation and testing with system-level cooling technologies.
* Conduct mechanical design validation and testing for electronic assemblies.
* Coordinate Circuit Packaging technologies.
* Perform component and system reliability analysis.
Minimum Qualifications:
* BS in Mechanical/Thermal or Chemical Engineering.
* 15+ years of experience in the design, simulation, and testing of thermal solutions for electronic devices and systems.
* Extensive experience with advanced air-cooling technologies.
* Experience with liquid cooling and/or immersion cooling.
* Experience with troubleshooting and thermal validation with data acquisition systems.
Preferred Qualifications:
* MS or PhD in Mechanical or Chemical Engineering or related field.
* 20+ years of relevant proven experience in microelectronics thermal cooling.
* Experience with JEDEC JESD 51 thermal testing standards.
* Experience with Thermal Interface Material Thermal Conductivity Testing procedures.
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Cisco will consider for employment, on a case by case basis, qualified applicants with arrest and conviction records.
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