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Broadcom is looking for a principal silicon validation and verification engineer. In this highly visible role, you will perform post silicon validation and characterization of high-speed analog and mixed-signal blocks; and you will collaborate with cross functional teams to launch ASIC products for data center networking. 

Qualifications include: 

M.Sc. in Electrical Engineering or Computer Engineering with 10+ years of experience in analog and mixed signal IP validation and verification for high-speed data center networking and optical I/O or PhD. in Electrical Engineering or Computer Engineering with 7+ years of experience in analog and mixed signal IP validation and verification for high-speed data center networking and optical I/O. 

Bench test debug and validation of clock generation and timing IPs, data converters, TIAs, modulator drivers, clock and data recovery (CDR) and SerDes. 

Testing and characterization of various control loops such as PLLs, LDOs. 

Deep understanding of signal integrity and power integrity for high-speed designs and experience with PI and SI measurements for correlation and debugging purposes. 

Experience in test development, debug, and reporting.

Ability to work with Matlab or Python. 

Experience in assessing design bugs and recommending workarounds.

Experience in debugging compliance test failures of standard I/Os. 

Experience with measurement equipment such as DCO, oversampling/real time scopes, and network analyzers. Experience with RF and high speed probing is a plus. 

System knowledge of current generation and next generation of optical I/Os using silicon photonics-based transceiver architectures and standards is a plus. 

Understanding of high-speed optical and electrical interconnect architectures and IEEE standards. 

Strong analytical thinking and problem-solving skills with excellent attention to details.

Must be organized, self-motivated and able to work effectively across internal and end customers teams.

It is a plus if the candidate has a good understanding of advanced packaging (2.5D / 3D) architectures.

Highly Desired Qualifications:

Strong written and verbal communication skills, with the specific ability to speak to various technical and management levels. 

Proactive, collaborative and creative approach to innovation, technical development and consensus facilitation to influence optimal project results. 

Excellent time and task management, and interpersonal skills. 

Willingness to travel when required.

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $141,000 - $225,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

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