At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Position Description:

As the member of the APAC Tensilica IP Field Applications Engineering (FAE) Team, you will participate in driving technical and business campaign success with industry leading semiconductor and system companies.Understand Cadence’s end customer’s IP needs and provide front line technical support in Pre-Sales and Post-Sales process.Champion the customer needs and work with Sales Team, R&D and Product Marketing to develop competitive and creative technical solutions to win campaignsBe a key contributor driving product roadmap direction for our next generation productsMaintain and develop local Tensilica Software Partner

Position Requirements:BS degree in Electrical Engineering/Computer Science or related fieldAt least 8+ years of SoC and/or embedded software or DSP algorithm design experienceHave strong customer facing skills to be able to establish technical & management credibility with the key technical decision makersHave programing experience and/or knowledge of one or more of Digital Audio, DSP, imaging or computer vision technologiesPrevious experience with DSP processor core (Tensilica/CEVA/ARC is preferred) or derivatives is highly desirableExperience with DSP & CPU architectures desirable – including architectural, software or HW/Debug relatedExperience of embedded software process for DSP development is beneficial, particularly for embedded DSP core architecturesEffective communication in English is requiredWe’re doing work that matters. Help us solve what others can’t.