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To be response for Front end assembly product of HPL/HRS pump. Need to understand and do failure analysis.

Process development of chip, lens, fiber attachment methods using solder and epoxy.Process development of component attach methods using epoxy and/or solderWork closely with team members on conceptual design layout, vendor interaction, package prototyping, testing, and performance characterizationContributes to failure mode analysis (FMA) and qualification of productPerform data analysis utilizing DOE, SPC, and FMEA tools regularly throughout product life cycleGenerates BOMs, assembly work instructions and engineering reports for new processes/productsTransfers processes to contract manufacturers primarily in AsiaPlan and execute on schemes to improve product yield and reliabilityRecommends and executes qualification tests for new processes/components

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