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Work with business unit marketing and IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new advanced silicon node products (5nm, 3nm, 2nm and beyond)

Work with IC design, system design, package SI/PI & thermal engineering teams to design custom packages

Ensure designed packages meet CPI, SI/PI, and stringent thermal requirements (1000sW+) of advanced node cutting edge silicon products

Research, develop, and productize new materials such as TIM, build-up-film, underfill etc. in support advanced node silicon (5nm & 3/2nm) POR definition

Manage IC packaging activity from concept through development, qualification and high volume production

Be a specialist and able to define assembly BOM, process, troubleshoot, support on packaging issues on new advanced technology

Implement, fine-tune, and productize newly developed technologies into HVM

Create package design documentation and assembly instructions

Work close with QA and customers to resolve quality issues

Interface with packaging assembly and substrate suppliers for new product bring-up, qualification and production ramp

Interface with other operations functional groups such as product engineering, foundry, test, and QA

Participate in package technology development and/or other business productivity projects which have broad team impact (e.g. assembly process enhancement, new TIM material development etc.)

Interface with tier #1 external customers for custom ASIC programs or as needed for development support, quality and/or other issue resolution

Support NPI bring-up, pkg qual, and sustain support in production + multi-source activities for capacity, cost, & manufacturing flexibility needs

Job Requirements

Education: BS/MS/PHD in STEM/Material Science/Electrical/Mechanical Engineering

Experience: BS +8 years of experience or MS +6 years of experience or PhD + 3 years of experience is required

Deep understanding of signal integrity and power integrity concepts such as characteristic impedance, s-parameters (RL, IL, FEXT/NEXT etc.), power plane impedance profile requirements and optimization etc.

Strong authority on Cadence APD for custom substrate design

Hands-on expertise of advanced and new assembly processes for flipchip, MCM packages, and 2.5D for advanced node silicon products (5nm, 3/2nm and beyond)

Good understanding of materials as related to Chip Packaging Interaction (CPI)

Familiarity with wafer BEOL as related to CPI (top metal, AP, passivation, UBM, bumping etc.)

Knowledge of advanced substrate manufacturing/process is a must (e.g. SAP/mSAP, PSPI w/ Cu RDL etc.)

In depth knowledge of failure analysis techniques on advanced node silicon (5nm, 3/2nm etc.) products with ELK and MiM structures

Conceptual knowledge of package cost structure

Strong project management, communication and leadership skills

Must have knowledge of GD&T and be able to read/comprehend mechanical drawings

Good understanding of manufacturing and quality engineering fundamentals (DOE, process capability indices, etc.)

Job requirements are broad; the candidate must be able to expand and grow in multiple disciplines (manufacturing/quality, materials, electrical, thermal, and mechanical)

Track record of innovation and subject matter expertise through journal publications and/or patent awards is desired

Familiarity with advanced technologies such as 2.5D, 3DIC, glass substrate etc.

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $94,000 - $150,000

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

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