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Job Description:Broadcom, a leading company in a broad range of semiconductor solution, is looking for a talent in IC package design to support growing business needs.
This position to open to talents with 8 years of relevant experience and a BS degree, 6 years with a MS degree, or 3 years with a PhD degree.
Skills in physical design (place & route) of an IC package are required. Experience in 2.5D/3D IC package design is highly preferred.
Other relevant skills include experience and knowledge in silicon design, advanced package technology, CMOS technology, HPC product thermal solutions, and package-level reliability analysis.
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $119,000 - $190,000
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
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