**Introduction** As a Hardware Developer at IBM, you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market. **Your role and responsibilities** The India System design team is responsible to own and deliver System design milestones for IBM POWER and mainframe platforms. The team collaborates with Global System design & development teams and stakeholders. As a Semiconductor Packaging designer, it involves designing laminate products, laminate test vehicles, and the test cards and silicon test sites used to validate the packaging technology. Responsibilities As Package Designer, the responsibilities include - Lay out the signals and power delivery structures using the design tools. - Post design completion, perform checks to ensure an error-free package design, including DFM (Design For Manufacturing), aiming for a high laminate yield in manufacturing. - Design checks that encompass both manufacturing and electrical aspects, necessitating a strong understanding of ground rules and electrical parameters. - Close communication with the customer for design inputs, team members in the design process, and suppliers for design for manufacturability. **Required technical and professional expertise** · 4-10years of total experience in Laminate and/or PCB design. · Demonstrated experience in Cadence design tools. · Minimum of 4 years’ experience with Cadence Design suite, like APD and/or Virtuoso or equivalent tools like Seimens Mentor Graphics · Demonstrated communication skills in a customer-facing environment. **Preferred technical and professional experience** · Engineering/Science Degree required, with a preference for Electrical Engineering.