If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

 

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We value open communication, mutual trust, and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID: 73990 

About Business Unit

We are looking for a Semiconductor Packaging Process Development Winter Spring Co-Op to join the team in Irvine, CA for a 6 month period starting in January, 2025!

Packaging Process Development is part of the Skyworks Technology and Manufacturing Group, which is responsible for the microelectronics packaging technology development. 

Job Description

The Winter/Spring 2025 Co-Op will be responsible for supporting the packaging team with activities such as Fine Pitch FlipChip development and SMT (Surface Mount Technology) development. They will also have exposure to DPA (Destructive Physical Analysis) and will analyze assembly data, generate data summary reports, and help summarize or draw conclusions from the data. They will also help work on NTI (New Technology Introduction) qualification activities such as executing the DoE plan, performing Reliability early look data collection. The Packaging Co-Op will work closely with engineers across multiple functional teams, such as PE, DE, quality/reliability, NPI, Component and Mexicali factory colleagues to develop next generation packaging technology and support trouble shooting mass production issues.

Job Responsibilities Preparing cross section samples for DPA validation. Drafting engineering build requests in Skyworks assembly facility. Generating assembly build report. Executing NTI qualification DoE, coordinating data collection and performing data analysis. 

 

Key Qualifications Currently enrolled in B.S., M.S., or Ph.D. program for Mechanical Engineering, Material Science, Electrical Engineering, Physics, or other relevant specialization from an accredited 4-year university. Basic knowledge of IC packaging.  Deep knowledge on fine pitch flipchip interconnection methods and solder joint IMC behaviors. Hands on experience in SiP package, SMT, 3D stack technology, solder joint reliability, low temp solder, failure analysis, or optical microscope & SEM/EDX instrument. Able to prepare cross section sample for SEM/EDX analysis (on job training will be provided). Understanding of engineering documents and specifications. Excellent written and verbal communication skills, interpersonal skills, and presentation skills. Strong data analysis skills.

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The typical pay range for an Engineering intern across the U.S. is currently USD $26.00 - $47.50 per hour and for a Non-Engineering intern across the U.S. is currently USD $22.50 - $42.00 per hour. Starting pay will depend on level of education, the ultimate job duties and requirements, and work location. Skyworks has different pay ranges for different work locations in the U.S.

 

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.