As a Senior Hardware Manager at Nokia’s San Jose location, you will guide a dynamic team of electrical and mechanical engineers dedicated to developing and designing high-speed telecom boards. Your role is pivotal in bringing innovative products from concept to production, ensuring our telecommunications solutions meet market demands. Collaborating closely with cross-functional teams, you'll drive projects that encompass product development, sustainable engineering for existing products, and cutting-edge technology research. The work environment fosters creativity and collaboration, with a strong emphasis on hands-on guidance. You’ll actively engage in guiding hardware design and thermal solutions, making a tangible impact on our product lineup. If you thrive in a fast-paced, supportive atmosphere where your expertise shapes the future of telecommunications, we want to hear from you!
 

You have:

Bachelor’s degree in Mechanical Engineering or related field; Master’s preferred 10+ years of experience in hardware management and team leadership Strong understanding of high-speed Ethernet standards and OTN Proficient in thermal design for high-powered, densely packed circuit packs Hands-on experience with board design tools like Cadence and CREO

It would be nice if you also had:

Experience with ARM-based processors and FPGAs Knowledge of PCB fabrication and assembly design rules Familiarity with NEBS, ETSI, and ANSI standards
  Guide and manage the daily activities of a high-performing team of Board designers, mechanical and thermal engineers in the design of high-speed telecommunications products. Drive the design, testing, validation, and production release of Chassis and Printed Circuit Boards, ensuring alignment with industry standards. Provide hands-on technical guide in hardware development, including schematic capture, layout, and Engineering Design Verification Testing (EDVT). Collaborate with cross-functional teams (SW, FW, SDVT, MFG, Optical) to define product features based on mechanical, electrical, and thermal trade-offs. Implement cooling solutions for high-powered, densely packed circuit boards, leveraging expertise in thermal design and engineering. Oversee ODM vendor collaboration for design schematic reviews and guidance during the development process. Supports product lifecycle from concept through pre- and post-production release, ensuring smooth transitions and quality outcomes. Mentor and develop team members, focusing on hiring, coaching, and establishing development goals for sustained team growth.