Description

Job Description

Responsible for defining package design rules, process flow and material set for new products including automotive power module packagesDrive alignment between module design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modulesDevelop new assembly technologies, run process DOE’s, to define process windows for new package developmentDefine and Drive reliability testing and qualification of new module packages in conjunction with the reliability groupWork closely with offshore assembly and substrate partners to develop new processesWork closely with New Product Definition teams to define packages to meet their requirementsCollaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module productsTransfer knowledge developed in the NPI process to the sustaining team to ensure a smooth transition to production

Job Requirements

BS Degree in Electrical Engineering, Mechanical Engineering, Material Science5 years of experience in semiconductor packaging technologyExperience in leaded multi-die packagesUnderstanding of organic laminate technologies manufacturing and supplier capabilities.Experience in SMT or passive integrated package assembly is a plus.Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation (Flip Chip is a plus)Experience with package substrate design rules, tools (including AutoCAD)Knowledge of AEQ Automotive reliability requirementsKnowledge of APQP automotive development processKnowledge of JEDEC/IPC design standardsAbility to set-up Design Rule Checks for verification of every aspect of the PCB layout a plusAbility to work in a fast-paced, high stress environment with high rates of change