Job Description

Job Summary

This senior technical contributor role will develop and resolve issues on advanced packages for high performance power semiconductor products with high reliability, low cost and mass production robustness by collaborating with multiple departments (Design, Assembly, Test, Reliability Engineering, Quality, Sales and Marketing Team) and suppliers/OSAT’s around the world.

Job description

Responsibility for packaging design on advanced high power discrete, muti-chip, stacked and module packages.Analyze stress, thermal capability and electrical performance with in-depth knowledge of thermal-mechanical and electro-chemical interactions.Define BOM, assembly process development, assembly specification and qualification per standard requirements.Resolve package reliability and assembly issues with thorough knowledge in the whole assembly processes.Analyze assembly process SPC, yield improvement, cost, throughput and capability analysis.Collaborate with device design / product engineering teams and external high volume packaging vendors to achieve qualification targetLead package development projects to establish package manufacturability and reliabilityCollaborate with cross functional teams to help develop a packaging roadmap aligned with the company’s product strategy and revenue targets.
Qualifications
BS Degree in Electrical Engineering, Mechanical Engineering and Material ScienceMinimum experience 10 years in semiconductor packaging technology with hands-on design for manufacturability.Experience in semiconductor, microelectronics, direct bonded or plated Cu isolation, power packaging and assembly engineering including high current clip, various wire bonding and module assembly preferred.Experience leading a project (program management).Fluency of ACAD software.Familiarity of package related design/simulation software (thermos-mechanical, thermal and electrical).Excellent problem solving skills, an analytical approach to tasks and understanding of SPC techniquesExtensive experience collaborating with OSAT vendors/suppliers, Experience in building a supply chain of vendors and service providers.Experience in SMT or passive integrated package assembly, multichip, stacked dies packages and assembly automation.Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach (Solder and epoxy), Wire-bonding (Cu and Al bonding), Molding, and Package Singulation.Experience in qualification of high voltage/power packages. Qualification in very high humidity and corrosive environment.Knowledge of AEQ reliability requirements and APQP automotive development processKnowledge of JEDEC/IPC design standards.Strong in English oral and written communication skills.
Additional Information

Renesas is an embedded semiconductor solution provider driven by its purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.  
 
With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We remain agile and fearless as we accelerate our growth, encouraging everyone to play an active role with an entrepreneurial mindset and accountability.     
 
At Renesas, you can: 

Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.  Make a real impact by developing automotive, industrial, infrastructure, IoT, and sustainable products and solutions to meet our customers’ evolving needs and help people and communities thrive tomorrow.  Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups (ERGs), will help you excel from the first day.    
 

Are you ready to own your success and make your mark?  
 

Join Renesas. Let’s Shape the Future together.  

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.