The candidate will work closely with Sales Account Managers and technical field application engineers supporting technical campaigns by delivering workshops, product demonstrations, training, and onsite support. The candidate will have good knowledge of the Cadence toolset and/or equivalent competitor toolsets in the context of multiple flows including high-speed signal design, power design, signal integrity and electrical constraints definition. Design experience and industry knowledge of Signal, Power, and Thermal analysis are required, as associated with IC, package, and PCB designs.
The candidate needs to have the ability to analyze the customer's environment and evaluate appropriate solutions. Be knowledgeable and aware of competitive technologies. Anticipates technical issues and develops creative solutions before they become a problem. Takes technical lead on a wide range of projects. Ability to understand high-speed, high-performance signal and power integrity-related issues, and work with peers and other business groups. Able to work on-site with customers without supervision. Able to communicate effectively with Cadence R&D, Product Engineering, Marketing and with customers. Understands customer success criteria and is committed to ensuring customer success.
In this position you will be an expert in Signal/Power Integrity, 2.5D/3D electromagnetic extractions, and thermal analysis for IC Package and PCBs. Your responsibilities are driving technical campaigns and software evaluations with customers. Train and ramp-up new customers in running Sigrity SI/PI/Thermal analysis and Clarity 3D full-wave electromagnetic extractions. You will be working with customers to analyze advanced IC Packages and PCBs with latest technologies including DDR5/LPDDR5/PCIE5. You will be a part of the North America application engineering team and will be based out of our Cadence Austin Texas office.
This is a great opportunity to gain in depth experience in EDA tools and to get familiar with customers SI/PI analysis challenges, 2.5D/3D EM model extraction and thermal analysis.
Requirements:
Bachelors or Masters degree in Electrical or Electronics Engineering with at least 3 years related experience. In-depth knowledge of EDA industry with strong background in Signal Integrity, Power Integrity, Electromagnetics, Thermal, and RF related to Package and PCB Design is required. Candidate should have experience in Cadence Allegro platform tools including: Sigrity, Clarity, PCB Editor, ICP, or competitive tools in these areas. The candidate must possess excellent written and verbal communication skills. Ability to present and clearly articulate solutions individually, and in front of medium to large groups is essential.
· Excellent communication and presentation skills. You will have to work with customer as well as internal sales teams, product engineering, and R&D teams.
· Excellent problem-solving skills
· A team player who is passionate about technology but also understands business requirements
· Willingness to travel locally and spend time on site with customers
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