At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsbilties:

•    Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product        development cycle.
•    Conducting SI COE analysis, including
o    Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and        setup to use, as well as a good understanding of the criteria for each interface.
o    Modeling the connector with the consideration of manufacture impact and application impact. 
o    Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community.
•    Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance.
•    Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation.
•    Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures.
•    Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization.
•    Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response.
•    Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs.
•    Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards.•    Should have total work experience of 3-8+years.
•    Minimum of 5+ years of work experience in a signal integrity engineering role or related   experience 
•    Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables) 
•    Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT).
•    A solid understanding of statistical analysis and AI training. 
•    A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior 
•    Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.  
•    Familiarity with printed circuit board design, fabrication and assembly.  
•    Familiar with material, manufacturing process, and manufacture inspection. 
•    Familiar with at least one programming language, such as Matlab, python, C++, VB, etc.
•    Excellent verbal and written communication skills 
•    Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies
 

DESIRED SKILLS

•    Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD)
•    Communication systems (high-speed servers, switches, routers, storage)
•    Signal conditioning techniques (equalization, amplification)
•    SixSigma methodologies or other strong data analytics background a PLUS.
•    Experience in project leadership, especially as it applies across design, development & manufacturing teams
•    Direct customer design and support experience
•    Application and test knowledge of high-speed devices and equalization techniques 
•    Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or   similar systems

Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork