Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Responsibilities will include, but are not limited to:Perform FE simulation support for mechanical & thermo-mechanical analysis: Strip-Level & Component-Level Warpage / Package Stress / Board-Level Solder Joint Reliability / Static & Dynamic Flexural BendingAssist Package Design Team to define a spectrum of design guidelines for optimal and cost-effective IC packaging options in COB, BOC, MCP, Flip Chip & TSV productsConduct design feasibility study and technical risk assessment to identify potential qualification risks in new product launchesPerform model correlation & validation with empirical data and refine existing modeling methodology for prediction accuracy enhancementDevelop efficient modeling approach and quick technical risk assessment for design optimizationEstablish advanced modeling approach to address new design / packaging / process / customer requirementsCollaborate with functional teams, laboratories, and suppliers on material characterization & test vehicles for detailed modeling inputs and validations

Requirements:Minimum bachelor’s degree with good Honor Class in mechanical or material engineering Minimum 3 years of simulation working experience in relevant semiconductor industryProficient in ANSYS and other similar computer-aided engineering software tools is a must; Knowledge in ANSYS APDL scripting is preferableStrong physics fundamentals in thermo-mechanics, solid mechanics, mechanical dynamics, damage mechanism, cyclic fatigue, fluid dynamics, failure analysis and material scienceGood understanding in wafer-level, die-level, process-level, strip-level, component-level, board-level, product-level and/or system-level simulation modelingGood knowledge on package level/board level/die level reliability testing, empirical data collection and failure analysisKnowledge or hand-on experience on material characterization testing and analysis for advanced packaging materialsProficient in MS Office and familiar with AutoCAD and Cadence softwareExperiences in data science analytics and statistical software such as JMP or Minitab is a plusAbility to work effectively in a team environment as well as to manage multiple projects concurrentlyGood English oral communication, technical presentation, and written skills

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.