Company Description

At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital®, G-Technology™, SanDisk® and WD® brands.

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

Job Description

Perform package and PCBA  assembly test defect from production, qualification on semi-finished or finished products. Define FA flow for each FA case. Generate FA report and assist process engineer for root-causing of defect/s. SME on key FA equipment, maintain the FA tracking and FA equipment log sheet. Develop the FA process and FA capability for new product and new technologies.

QualificationsBachelor Degree and/or Master in Electrical/ Electronic or Microelectronic Engineering with minimum 5 years in failure analysisFamiliar with package and device analysis methodologyFamiliar with semiconductor and SMT assembly process and technologyFamiliar with memory product technology and structureUnderstand memory product test process and methodologySkillful in performing failure analysis with FA tools or methodology such as 3D X-ray, CSAM, SEM/EDX, chemical decapsulation, TDR, curve tracer analysis, optical microscopes, hot spot analysis, cross-section and dye and Pull analysisStrong solder joint defect assessment skills.Good communication and presentation skillsGood teamwork spiritFluent in English speaking, reading and technical FA report writingPrevious FA experience in SMT assembly environment is preferred

Additional Information

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Western Digital has received reports of scams where a payment is requested on Western Digital’s behalf as a condition for receiving an offer of employment. Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to [email protected].