• Perform Mold and Laser Deflash Process development activities (Parameters optimization, verification & Freeze) according to project requirements i.e. timeline, quality and cost.

• Create or update DFMEA, PFMEA and process specifications with respect to mold and laser deflash process.

• Support engineering and qual builds in accordance to the project timeline.

• Work with material and equipment suppliers for continuous process improvement.

• Participate in Design Rules, Design of Manufacturing (DFM), Gap Analysis and problem-solving during development and pre-production stage.

• Participate and contribute to generation of new ideas or new packaging technology (from mold and laser deflash).

• Responsible for technical handshake and knowledge transfer from development to operation.

• Participate in the training of other engineers or personnel within his/her area of expertise as and when required. Performs any other duties as assigned by supervisor.

Job Specifications

• At least 5 years of working experience with a Degree/Masters preferably of in Mechanical or materials engineering. 

• Good Process/ equipment knowledge in semiconductor packaging, assembly especially in Auto Mold/Laser Deflash for Power packaging.

• Preferred skills in Statistic Analysis (JMP or Minitab) & Computer skills, Statistical Stack Up Tolerance Analysis and Good communication and presentation skills.