Staff Package Design Engineer Job Description + Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging. + Package technologies qualification for consumer & industrial power as well as automotive power applications. **Key Responsibilities** + Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM). + Work with OSAT/CM to develop, run DOE to optimize processes, establish process spec & monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer. + Work with Product groups and Reliability team, qualify new packages and processes within required time frame & further address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses. + Ensure smooth transition into production & implement ramp up monitor. + Participate in packaging roadmap development & focus on execution, develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging and flip chip interconnects. + Establish & maintain package design rules. Qualifications + Doctorate/Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering. + 6-12 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging. + Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software. + Strong interpersonal and communication skills. + Strong analytical and presentation skills. + Knowledge of wire-bonding & multi-chip module technologies a plus. + Fluent Chinese and English skill Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose ‘ **To Make Our Lives Easier** .’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘ **To Make Our Lives Easier** .’ At Renesas, you can: + **Launch and advance your career** in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. + **Make a real impact** by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. + **Maximize your performance and wellbeing** in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark? Join Renesas. Let’s **Shape the Future** together. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, disabilities, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement (https://jobs.renesas.com/diversity-and-inclusion) . 1. **Department** Manufacturing 2. **Location** Zhubei 3. **Remote** No Requisition ID 20019051_2025-02-19 Apply Shortlist