Job Description + Responsible for defining package design rules, process flow and material set for new products including automotive power module packages + Drive alignment between module design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules + Develop new assembly technologies, run process DOE’s, to define process windows for new package development + Define and Drive reliability testing and qualification of new module packages in conjunction with the reliability group + Work closely with offshore assembly and substrate partners to develop new processes + Work closely with New Product Definition teams to define packages to meet their requirements + Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products + Transfer knowledge developed in the NPI process to the sustaining team to ensure a smooth transition to production Job Requirements + BS Degree in Electrical Engineering, Mechanical Engineering, Material Science + 8 years of experience in semiconductor packaging technology + Experience in leaded multi-die packages + Understanding of organic laminate technologies manufacturing and supplier capabilities. + Experience in SMT or passive integrated package assembly is a plus. + Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation (Flip Chip is a plus) + Experience with package substrate design rules, tools (including AutoCAD) + Knowledge of AEQ Automotive reliability requirements + Knowledge of APQP automotive development process + Knowledge of JEDEC/IPC design standards + Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus + Ability to work in a fast-paced, high stress environment with high rates of change + Able to work with people in the US timezone