If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.
At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We value open communication, mutual trust, and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.
Requisition ID: 73989
Job SummaryIn this role, candidate will manage development and execution of the Packaging Process roadmap, working with internal design, manufacturing, & reliability teams and external material, equipment, & manufacturing suppliers.
Job DescriptionEngineer, Packaging Process Development
Location: Irvine, CA, US
Candidate will be responsible for creation of project plans including timeline, cost, and risk assessments and mitigation plan.
In addition, candidate is expected to manage build lots and execute the technology & design rule release to production through characterization, DOE, reliability testing, qualification, & high volume validation.
Typical projects focus on process development, design rule improvement, material development, cost saving, and solving quality issues.
Candidate will rely upon program management skills to keep multiple activities with scope and schedule of the overall program objectives.
Travel to domestic facilities, North American production facility, and international suppliers may be needed.
Job requirements:
Minimum a Bachelor's Degree qualification in Material Science, Material Engineering, Chemical Engineering, Mechanical Engineering, Semiconductor Engineering, or other related specialization. Minimum 2 years of relevant technical experience in semiconductor packaging technology. Hands-on experience in SMT and Flip Chip material & process preferred. Technical expertise required in failure analysis, material interaction, and yield improvement. Strong understanding of SPC techniques, FMEAs, Six Sigma, and Reliability Standards. Candidate is expected to possess excellent communication skills - verbal, written, and presentation. High proficiency in English communication at business level. Strong driver who is assertive and results/goal oriented. Team player with good interpersonal skills and able to work efficiently with multi-functional and multi-cultural groups.
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The typical base pay range for this role across the U.S. is currently USD $112,500 - $215,900 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.
Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.