Company:

Qualcomm China

Job Area:Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Job Description

Job overview: Member of IC packaging team directly supporting customers with packaging related quality issues, product development and new applications. Daily support for mechanical FA lab operation and packaging issues triage

Examples of customer support areas:

Board level reliability (BLR) qualification.SMT (Surface Mount Technology)Packaging SMT/ BLR issue triage and root cause isolationProduct launch into HVM (High Volume Manufacture)Design for manufacturability (DFM) reviewsTechnology roadmap alignment and spec compliance reviewsFailing samples reviewsPublication of application notes and process recommendations

Examples of lab operations support areas:

FA (Failure Analysis) plan definitionFA reports Lab daily operations supervisorySupports to technicians

Examples of advanced package technologies supported

BGA (Ball Grid Array) and CSP (Chip Scale Package)WLP (Wafer Level Package)FO-WLP (Fan Out Wafer Level Package)PoP (Package on Package)LGA (Land Grid Array)

Other duties as needed

Collaboration with internal teams (quality, design, NPI, modeling, etc) to give regular profess updatesProject/ case management; statistical analysis including DOE methodsInterface with external suppliers and equipment vendors to understand latest technologiesIndustrial benchmarking and competitive analysis

Minimum qualifications

Required to be fluent in Mandarin with functional proficiency in EnglishPermitted to work in mainland China with ability for oversea travelMinimum of five years of experience in SMT/ BLR and package technology developmentMust have strong written and oral communication

Working knowledge of

Package assembly processSurface mount technologyPackage reliability testing and failure modesUnderfill & reworkHigh temperature warpage analysisIndustry packaging trends and customer considerationsPackage material analysisMechanical failure analysis techniquesFailure analysis tools & data analysis (Microscope/ Shadow Morrie/ X-ray/ CSAM/ EDX/ IR…)IPC JEDEC and other industry specifications

Preferred qualifications

Independent decision maker and problem solver with little oversight neededPrevious experience with portable consumer products/ auto products and direct manufacturing experience with package assembly or SMT strongly preferred

All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

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