We are looking for a Mechanical Stress Simulation Engineer to join our Testing team as a key player in the development of next generation of NVIDIA's Networking products infrastructure. This key position includes Simulating the mechanical stress developed in PCBs during various test stages in production line, develop new test/assembly techniques to reduce stress on key PCB components in close interaction with Hardware and Layout Engineering, Mechanical and Infrastructure teams.

What you'll be doing:

Perform PCBA Stress Simulation of ICT stations to optimize the setup and take active part in investigation of strain gauge test results and experiments.

Perform Stress Simulation for Assembly Infrastructure.

Collaborate in research and development of new techniques to reduce stress developed in PCBA during testing and assembly of the product.

Instruct and guide product designers to implement PCB restrictions/rules to reduce stress on PCB.

Instruct and guide Equipment manufacturers to implement PCB restrictions/rules to reduce stress on PCB.

Perform Tier 2 support for ICT stations and take active part in investigation of strain gauge test results and experiments.

What we need to see:

B.Sc. in Mechanical Engineering or higher.

3+ years of experience in Stress Simulation of PCBs and mechanical components/assemblies.

Strong understanding of FEA theory and proven experience in at least one simulation tool (such as Ansys Mechanical).

Proficiency with 30 CAD, such as Inventor and/or SolidWorks and/or Creo.

Experience in designing metal/plastic components for CNC machining.

Experience in defining and executing DOE (design of experiment), including working with various lab measurement equipment.

Self-motivated with a sharp learning curve and able to work independently and as a teammate.

Strong verbal and written communication skills in both English and Hebrew