**Company:** Qualcomm Semiconductor Limited **Job Area:** Interns Group, Interns Group > Interim Intern **Qualcomm Overview:** Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in. **General Summary:** The Qualcomm DRAM System/Technology Team in Process and Packaging Solutions Group has an internship opening in the areas of 3D DRAM Design and Architecture. The candidate will assess and optimize the 3D DRAM architecture to improve system KPIs such as bandwidth, latency, power, thermal, and area efficiency. The candidate will explore the best organization of near-memory processing units along with the system and memory buses so that the extreme bandwidth of 3D DRAM will be fully utilized across the compute fabric. The candidate will work on solutions addressing manufacturability and repairability of both DRAM and compute fabric. The candidate is expected to understand the concepts of DRAM bank organization and signaling, bus and compute fabrics as well as the 3D integration. This position offers the opportunity to work across multiple organizations such as process and packaging team, AI and compute architects, memory controller team, global SoC team, and emulation team. Providing timely feedback and updating architecture and design trade-offs to the team is essential. **Responsibilities:** + Develop and optimize 3D DRAM bank organization and near-memory computing architectures to achieve high density, high TOPS/mm2, and high TOPS/W + Develop and validate models for 3D DRAM performance, power, and yield as function of bank, TSV, and power distribution choices + Develop novel fabrics for best/robust distribution of high-bandwidth data from 3D DRAM memory arrays to the near-memory computing units across various workloads for mobile, compute, and XR applications + Simulate and emulate system performance of 3D DRAM architecture choices across AI, compute, and mobile workloads + Floorplan 3D DRAM chips under 3D integration manufacturing constraints, testability, repairability, and high performance **Minimum Qualifications:** + Experience in ASIC design, mixed-signal design, and performance modeling + Good knowledge of memory architecture, buses, and 2.5D/3D integration + Proficiency in use of EDA tools, Matlab, and Phyton + Master's or Ph.D. in Electrical Engineering, Computer Science, or a related field **Preferred Qualifications:** + Experience in programming language (C/C++/Phyton) or scripting language (Perl/Python) + Experience in Matlab/Transaction Level Simulators to be able to model and optimize dataflow + Experience in DRAM architecture simulators such as DRAMsim3, Ramulator, and DRAMSys + Experience in memory circuit design (SRAM/DRAM/Flash/ROM/OPT, etc) + Ability to develop Verilog/Verilog-A/Verilog-AMS models of critical dataflow is strong plus + Familiar with the DRAM datasheets and IO interfaces **Soft Skills:** + Self-Starter with good communication skills and team-working spirit + Strong problem-solving and analytical skills + Ability to work independently and as part of a team **Applicants** : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail myhr.support@qualcomm.com or call Qualcomm's toll-free number found here (https://qualcomm.service-now.com/hrpublic?id=hr\_public\_article\_view&sysparm\_article=KB0039028) . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. 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If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) . EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification